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 SPI80N04S2-H4 SPP80N04S2-H4,SPB80N04S2-H4
OptiMOS(R) Power-Transistor
Feature
* N-Channel
Product Summary VDS R DS(on) ID
P- TO262 -3-1 P- TO263 -3-2
40 4 80
P- TO220 -3-1
V m A
* Enhancement mode * 175C operating temperature * Avalanche rated * dv/dt rated
Type SPP80N04S2-H4 SPB80N04S2-H4 SPI80N04S2-H4
Package P- TO220 -3-1 P- TO263 -3-2 P- TO262 -3-1
Ordering Code Q67060-S6014 Q67060-S6013 Q67060-S6014
Marking 2N04H4 2N04H4 2N04H4
Maximum Ratings, at Tj = 25 C, unless otherwise specified Parameter Symbol Continuous drain current 1)
TC=25C
Value 80 80 320 660 25 6 20 300 -55... +175 55/175/56
Unit A
ID
Pulsed drain current
TC=25C
ID puls EAS EAR dv/dt VGS Ptot T j , Tstg
Avalanche energy, single pulse
ID=80 A , V DD=25V, RGS=25
mJ
Repetitive avalanche energy, limited by Tjmax 2) Reverse diode dv/dt
IS=80A, VDS=32V, di/dt=200A/s, T jmax=175C
kV/s V W C
Gate source voltage Power dissipation
TC=25C
Operating and storage temperature IEC climatic category; DIN IEC 68-1
Page 1
2003-05-08
SPI80N04S2-H4 SPP80N04S2-H4,SPB80N04S2-H4 Thermal Characteristics Parameter Characteristics Thermal resistance, junction - case Thermal resistance, junction - ambient, leaded SMD version, device on PCB:
@ min. footprint @ 6 cm2 cooling area
3)
Symbol min. RthJC RthJA RthJA -
Values typ. 0.35 max. 0.5 62 62 40
Unit
K/W
Electrical Characteristics, at Tj = 25 C, unless otherwise specified Parameter Static Characteristics Drain-source breakdown voltage
V GS=0V, ID=1mA
Symbol min. V(BR)DSS VGS(th) IDSS IGSS RDS(on) 40 2.1
Values typ. 3 max. 4
Unit
V
Gate threshold voltage, VGS = V DS
ID=250A
Zero gate voltage drain current
V DS=40V, VGS=0V, Tj=25C V DS=40V, VGS=0V, Tj=125C 2)
A 0.01 1 1 3.4 1 100 100 4 nA m
Gate-source leakage current
V GS=20V, VDS=0V
Drain-source on-state resistance
V GS=10V, I D=80A
1Current limited by bondwire ; with an RthJC = 0.5K/W the chip is able to carry ID= 200A at 25C, for detailed information see app.-note ANPS071E available at www.infineon.com/optimos 2Defined by design. Not subject to production test. 3Device on 40mm*40mm*1.5mm epoxy PCB FR4 with 6cm (one layer, 70 m thick) copper area for drain connection. PCB is vertical without blown air. Page 2
2003-05-08
SPI80N04S2-H4 SPP80N04S2-H4,SPB80N04S2-H4
Electrical Characteristics Parameter Dynamic Characteristics Transconductance Input capacitance Output capacitance Reverse transfer capacitance Turn-on delay time Rise time Turn-off delay time Fall time
Gate Charge Characteristics Gate to source charge Gate to drain charge Gate charge total Gate plateau voltage Qgs Qgd Qg
VDD =32V, ID =80A, VGS =0 to 10V VDD =32V, ID =80A
Symbol
Conditions min.
Values typ. 105 4430 1580 400 14 36 46 35 max. -
Unit
gfs Ciss Coss Crss td(on) tr td(off) tf
VDS 2*ID *RDS(on)max, ID =80A VGS =0V, VDS =25V, f=1MHz
53 -
S
5890 pF 2100 600 21 54 69 53 ns
VDD =20V, VGS =10V, ID =80A, RG =1.3
-
22 47 111 5.2
29 70 148 -
nC
V(plateau) VDD = 32 V , ID =80A
V
Reverse Diode Inverse diode continuous forward current Inv. diode direct current, pulsed Inverse diode forward voltage Reverse recovery time Reverse recovery charge ISM VSD trr Qrr
VGS =0V, IF =80A VR =20V, IF =lS , diF /dt=100A/s
IS
TC=25C
-
0.9 195 370
80 320 1.3 240 460
A
V ns nC
Page 3
2003-05-08
SPI80N04S2-H4 SPP80N04S2-H4,SPB80N04S2-H4 1 Power dissipation Ptot = f (TC) parameter: VGS 6 V
320
SPP80N04S2-H4
2 Drain current ID = f (T C) parameter: VGS 10 V
90
SPP80N04S2-H4
W
A
70 240
P tot
60 200
ID
50 40 30 20 10 0 0 20 40 60 80 100 120 140 160 C 190
160
120
80
40
0 0 20 40 60 80
100 120 140 160 C 190
TC
TC
3 Safe operating area ID = f ( VDS ) parameter : D = 0 , TC = 25 C
10
3 SPP80N04S2-H4
4 Max. transient thermal impedance Z thJC = f (t p) parameter : D = t p/T
10
1 SPP80N04S2-H4
K/W A
D
t = 29.0s p
10
DS (on )
=
V
DS
/I
0
ID
R
10
2
Z thJC
100 s
10
-1
1 ms
10
-2
D = 0.50 0.20 10
1 -3
10
0.10 0.05
10
-4
single pulse
0.02 0.01
10
0
10
-1
10
0
10
1
V
10
2
10
-5
10
-7
10
-6
10
-5
10
-4
10
-3
10
-2
s
10
0
VDS
Page 4
tp
2003-05-08
SPI80N04S2-H4 SPP80N04S2-H4,SPB80N04S2-H4 5 Typ. output characteristic ID = f (V DS); T j=25C parameter: tp = 80 s
190
SPP80N04S2-H4
6 Typ. drain-source on resistance RDS(on) = f (I D) parameter: VGS
13
SPP80N04S2-H4
Ptot = 300W
hg f
VGS [V]
A
160 140
e
a b c d 4.0 4.5 5.0 5.5 6.0 6.5 7.0 10.0
11 10
d
e
R DS(on)
9 8 7 6 5
f g h
ID
120 100 80 60 40 20
b c
e f g
d
h
4 3 2 1
VGS [V] =
d 5.5 e 6.0 f 6.5 g h 7.0 10.0
0 0 0.5 1 1.5 2 2.5 3 3.5
a
4
V
0 5 0 20 40 60 80 100 120 140
A
180
VDS
ID
7 Typ. transfer characteristics ID= f ( V GS ); V DS 2 x ID x RDS(on)max parameter: tp = 80 s
160
8 Typ. forward transconductance g fs = f(I D); T j=25C parameter: g fs
140
A
S
120 100 100
g fs
80 60 40 20
ID
80
60
40
20
0 0 1 2 3 4
V VGS
0 6 0 20 40 60 80 100 120
A 160 ID
Page 5
2003-05-08
SPI80N04S2-H4 SPP80N04S2-H4,SPB80N04S2-H4 9 Drain-source on-state resistance RDS(on) = f (Tj) parameter : ID = 80 A, VGS = 10 V
12
SPP80N04S2-H4
10 Typ. gate threshold voltage VGS(th) = f (T j) parameter: VGS = VDS
3.5
V
10
1.25 mA 250 A
R DS(on)
V GS(th)
98% typ 140 C
9 8 7 6 5 4 3 2 1 0 -60 -20 20 60 100 200
2.5
2
1.5
1
0.5
0 -60
-20
20
60
100
C Tj
180
Tj
11 Typ. capacitances C = f (V DS) parameter: VGS=0V, f=1 MHz
10
5
12 Forward character. of reverse diode IF = f (V SD) parameter: T j , tp = 80 s
10
3 SPP80N04S2-H4
pF
A
10
4
10
2
C iss C oss
10
3
IF
10
1
C
C rss
T j = 25 C typ T j = 175 C typ T j = 25 C (98%) T j = 175 C (98%)
10
2
10 5 10 15 20
0
0
V
30
0
0.4
0.8
1.2
1.6
2
2.4 V
3
V DS
VSD
Page 6
2003-05-08
SPI80N04S2-H4 SPP80N04S2-H4,SPB80N04S2-H4 13 Typ. avalanche energy E AS = f (T j) par.: I D = 80 A , V DD = 25 V, R GS = 25
700
14 Typ. gate charge VGS = f (QGate) parameter: ID = 80 A pulsed
16
SPP80N04S2-H4
mJ
V
600 550 12
E AS
500
VGS
450 400 350 300 250 200
10
0,2 VDS max
0,8 VDS max
8
6
4 150 100 50 0 25 45 65 85 105 125 145 2
C 185 Tj
0 0 20 40 60 80 100 120 140 nC 170
QGate
15 Drain-source breakdown voltage V(BR)DSS = f (Tj) parameter: ID=10 mA
48
SPP80N04S2-H4
V
46
V(BR)DSS
45 44 43 42 41 40 39 38 37 36 -60 -20 20 60 100 140 C 200
Tj
Page 7
2003-05-08
SPI80N04S2-H4 SPP80N04S2-H4,SPB80N04S2-H4
Published by Infineon Technologies AG, Bereichs Kommunikation St.-Martin-Strasse 53, D-81541 Munchen (c) Infineon Technologies AG 1999 All Rights Reserved. Attention please! The information herein is given to describe certain components and shall not be considered as warranted characteristics. Terms of delivery and rights to technical change reserved. We hereby disclaim any and all warranties, including but not limited to warranties of non-infringement, regarding circuits, descriptions and charts stated herein. Infineon Technologies is an approved CECC manufacturer. Information For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies Office in Germany or our Infineon Technologies Reprensatives worldwide (see address list). Warnings Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office. Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. Further information Please notice that the part number is BSPP80N04S2-H4 and BSPB80N04S2-H4, for simplicity the device is referred to by the term SPP80N04S2-H4 and SPB80N04S2-H4 throughout this documentation.
Page 8
2003-05-08


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